Principal Engineer

4 weeks ago

Richardson, Texas, United States Micron Technology Full time
Transforming Information into Intelligence

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Our Opportunity Summary:

We are seeking a highly skilled Principal Engineer - HBM SOC Physical Design to join our team. As a key member of our HBM HIG (High Bandwidth Memory - Heterogenous Integration Group), you will be responsible for the design and development of next-generation HBM DRAM products. You will work closely with a distributed team of Design Engineering, Product Engineering, Process Development, Package Engineering & Business Units to ensure our future HBM roadmap is successful.

In this role, you will apply your deep understanding of SOC Structural Design, high-speed interface design, high-performance computing architectures, and 2.5D & 3D package integration to understand and analyze bottlenecks and propose innovative architectures to target best-in-class performance, power, cost, reliability and quality for Micron's HBM product portfolio.

Key Responsibilities:
  • Design and development of next-generation HBM DRAM products
  • Collaboration with cross-functional teams to ensure successful HBM roadmap
  • Application of deep understanding of SOC Structural Design, high-speed interface design, high-performance computing architectures, and 2.5D & 3D package integration
  • Analysis and proposal of innovative architectures to target best-in-class performance, power, cost, reliability and quality
Requirements:
  • 7+ years of relevant job/skill-related experience
  • Excellent knowledge of Synthesis Design Constraints and Static Timing Analysis
  • Good understanding of computer architecture concepts, including SOC interconnects and bus standards like AMBA AXI, ACE, APB, AHB, etc.
  • BSEE or higher
What Sets You Apart:
  • Familiarity with DRAM operation and JEDEC specifications, preferably with the HBM product family
  • Knowledge of scripting languages such as Python
  • Experience in any of the following focus areas: memory array architectures, on-die and off-die high-speed signaling, PHY & interface development, power delivery network planning and optimization, power consumption reduction, CMOS requirements identification, packaging technologies, and thermal modeling
About Micron:

Micron is a world leader in the semiconductor industry, dedicated to your personal wellbeing and professional growth. We offer a choice of medical, dental and vision plans in all locations, enabling team members to select the plans that best meet their family healthcare needs and budget. We also provide benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

To learn more about Micron, please visit micron.com/careers.

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