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Lead Engineer for Integrated Circuit Packaging

2 months ago

Santa Clara, California, United States Apple Full time
Overview

Are you passionate about pioneering technologies that lead to innovative products? Do you possess a keen eye for detail and a commitment to excellence? At Apple, we understand that new insights can rapidly transform into exceptional products, services, and customer experiences.

About the Role

Join our Hardware Technology Packaging team, where we invent, design, and develop electronic packaging solutions for both internal and custom external components used in our consumer electronics, including devices like iPhone, iPad, Mac, Apple Watch, and Apple TV.

In this prominent position, you will take charge of complex package selection, structure optimization, and configuration for next-generation products.


Key Responsibilities
  • Execute the physical design of packages and modules for SoC, Memory, RF, and cellular chips.
  • Establish and enhance design verification and automation strategies to improve package design and release processes.
  • Lead methodology advancements, innovation, and efficiency enhancements in package design in collaboration with vendors and developers.
  • Coordinate with cross-functional teams at Apple for feasibility analysis, design, and selection of new product packages.
  • Ensure package designs meet SI/PI requirements.
  • Research and develop new CAD tools and design verification flows.
  • Engage in multi-functional discussions regarding package architecture and technology roadmaps.
  • Identify opportunities for cost savings and performance enhancements.
  • Perform extraction of S-parameters and develop package RLGC models.

Essential Qualifications

Bachelor's degree with over 10 years of hands-on experience in package design, with proficiency in Cadence Allegro platform tools or Mentor Xpedition platform tools.

Strong foundation in electrical, material, thermal, and mechanical engineering principles.

Familiarity with advanced package configurations and assembly/substrate technologies.

Experience with SI/PI tools, package model extraction, and understanding of substrate manufacturing processes.

Solid grasp of high-speed interfaces, including DDR, PCIe, and NAND.

Exposure to Unix environments and scripting languages such as PERL, Python, and TCL.

Ability to collaborate with design teams to translate IC/system requirements into package/SIP configurations.

Proven track record in driving package selection through feasibility studies and chip floor planning.


Preferred Experience
  • Familiarity with package design reviews and tools like CAM350/Valor or Calibre.
  • Knowledge of high-speed layout constraints and design for manufacturing.
  • Experience with RFIC and 5G package design.
  • Hands-on knowledge of Design Rules Check.
  • Experience with TSV, 2D/2.5D, and 3D package connections.
  • Familiarity with Cadence Concept HDL for schematic review.

Education & Experience

Bachelor's degree with over 10 years of relevant industry experience.


Compensation & Benefits

At Apple, base pay is just one component of our total compensation package, which is determined within a range based on skills, qualifications, experience, and location. Employees may also participate in stock programs and receive additional benefits such as comprehensive medical and dental coverage, retirement benefits, and reimbursement for educational expenses.


Diversity & Inclusion

Apple is an equal opportunity employer committed to inclusion and diversity, ensuring equal opportunity for all applicants.