Principal Engineer

Transforming Information into Intelligence

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

We're seeking a highly skilled Principal Engineer to join our team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life.

As an HBM Design Architect, you will be responsible for the design & development of next-generation HBM DRAM products, collaborating closely with a distributed team of Design Engineering, Product Engineering, Process Development, Package Engineering & Business Units to implement a common goal of ensuring our future HBM roadmap is successful.

You will apply your deep understanding of memory array architectures, high-speed interface design, logic & custom circuit design, memory subsystem operation, high-performance computing architectures, and 2.5D & 3D package integration to understand and analyze bottlenecks and propose innovative architectures to target best-in-class performance, power, cost, reliability and quality for Micron's HBM product portfolio.

Key Responsibilities:

• Design and develop next-generation HBM DRAM products
• Collaborate with cross-functional teams to ensure successful HBM roadmap
• Apply deep understanding of memory array architectures and high-speed interface design
• Propose innovative architectures to target best-in-class performance, power, cost, reliability and quality

Requirements:

• Familiarity with DRAM operation and JEDEC specifications
• Knowledge and experience in digital (Verilog) and analog (FastSpice & Hspice) modeling and simulations
• In-depth technical expertise in one or more areas - DRAM memory array design, high-speed clocking and interface development, logic and custom circuit design, power delivery optimization, CMOS & semiconductor device physics, 2.5D and 3D packaging technologies
• Proven track record of innovation and problem-solving in high-performance memory development
• 7+ years of relevant job/skill-related experience

What Sets You Apart:

• BSEE or greater
• In-depth technical expertise in one or more areas: RTL Design flow, in the DRAM process or Foundry process - DRAM product bring-up and debug - package technologies (TSV, hybrid bonding, interposers, etc)
• Good verbal and written communication skills with the ability to efficiently synthesize and convey sophisticated technical concepts to other partners and leadership
• A self-motivated, hard-working team player who enjoys working with diverse abilities and backgrounds
• Having an innovative approach that is open to improving upon any of our processes or products

Benefits:

• Choice of medical, dental and vision plans
• Paid family leave
• Robust paid time-off program
• Paid holidays

Equal Opportunity Employer:

Micron Technology is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.