Test Engineer with Security Clearance

Requisition Number: 30480 Required Travel: 0
- 10% Employment Type: Full Time/Salaried/Exempt Anticipated Salary Range: $79,869.00
- $180,000.00 Security Clearance: Ability to Obtain Level of

Experience:
Mid This opportunity resides with Warfare Systems (WS), a business group within HII's Mission Technologies division. Warfare Systems comprises cyber and mission IT; electronic warfare; and C5ISR systems. HII works within our nation's intelligence and cyber operations communities to defend our interests in cyberspace and anticipate emerging threats. Our capabilities in cybersecurity, network architecture, reverse engineering, software and hardware development uniquely enable us to support sensitive missions for the U.
S. military and federal agency partners. Leadership at HII
- Mission Technologies
HII's Leadership Capability Framework defines the standard of excellence expected of all leaders across Mission Technologies. Leaders are accountable for modeling these capabilities and building them within their teams:
* Know & Grow Your People
- Develop talent, empower teams, and build an inclusive environment.
* Build Relationships
- Strengthen trust, collaboration, and cross-functional partnerships.
* Take Ownership
- Drive accountability, execution excellence, and results.
* Customer First
- Anticipate mission needs and deliver value to our partners.
* Shape the Future
- Inspire innovation and align work with strategic priorities.
* Act with Urgency
- Make informed decisions and move with purpose. These capabilities define how leaders inspire teams, deliver results, and shape the future of Mission

Job Description
We are seeking a hands-on Electronics Packaging, Reliability & Test Engineer to lead prototype hardware build, reliability test, and failure analysis in support of the U.
S. Army Research Laboratory (ARL) in Adelphi, MD. This role blends electronics packaging, thermal/electrical/mechanical analysis, bench-level testing, and manufacturing/DFM to deliver rugged, field-ready systems. You'll collaborate in a multidisciplinary environment (EE, ME, materials, computer science, and research staff) to:
* Package and protect die-level and PCB assemblies using polymerics (adhesives, staking, encapsulation, underfills) and metals (solder alloys, sintered joints),
* Model stresses and failure modes (thermal, electrical, mechanical, vibration),
* Execute rigorous lab and field test campaigns (THB, temperature cycling, vibration, dielectric strength, partial discharge), and
* Perform both destructive and non-destructive analysis to drive design improvements. This is an excellent fit for engineers who love building, instrumenting, and testing their own designs-and who understand how materials, process, and environment drive reliability. HII has partnered with ARL for more than 18 years, supporting mission critical R&D, prototyping, and evaluation. This position offers the opportunity to lead technical activities, mentor junior personnel, and contribute directly to impactful, emerging technologies. Come support our work with the U.
S. Army Research Laboratory and join a world class team of groundbreaking scientists and engineers Test Engineer 2: $80,000
- $115,000 Test Engineer 3: $99,000
- $145,000 Test Engineer 4: $121,000
- $180,000 Essential Job Responsibilities
* Advanced PCB & Module Assembly
*
* Assemble and solder complex mixed-signal boards (analog/digital/RF), including SMT and through-hole.
* Integrate electronics into electromechanical housings, ensuring fit, thermal paths, strain relief, shielding, sealing, and serviceability.
* Implement packaging best practices: die attach, wire bonding, underfill/encapsulation/staking, conformal coating, and strain mitigation for connectors and harnesses.
* Materials & Process Engineering
*
* Select and qualify adhesives (air, bake, UV cure), underfills, potting compounds, coatings, and solder/sintered metallurgical systems based on CTE match, Tg, modulus, outgassing, moisture ingress, electrical performance, and service environment.
* Define process recipes (surface prep, cure schedules, bake profiles, reflow profiles, bond parameters) and create work instructions.
* Mechanical CAD & Simulation
*
* Create mechanical designs and engineering drawings (GD&T) in SolidWorks for custom enclosures, brackets, thermal interfaces, and fixtures.
* Conduct FEA/Multiphysics modeling in ANSYS Workbench or COMSOL for thermal stress, mechanical stress, electrical stress, and vibration/modal analysis; propose mitigations (stiffeners, damping, isolation, fasteners, fillets/chamfers, materials).
* Manufacturing & DFM
*
* Develop DFM guidelines and release designs for CNC machining, sheet metal, injection molding, and 3D printing; coordinate with machine shops/vendors and review NCRs/FAI results.
* Build/iterate test fixtures and jigs for repeatable assembly and measurement.
* Benchtop & Environmental Testing
*
* Set up and operate probe stations, heated stages, temperature-humidity-b