Silicon Photonics Packaging Eng. Coop

4 weeks ago


New York, United States Nokia Full time

Position: Silicon Photonics Packaging Engineer Co-op
Duration: 4 months
Date: May 2025 - Aug 2025
Location: Sunnyvale, CA or New York, NY Openings: 2

Education Recommendations

Current M.S. or Ph.D. student in electrical engineering, physics, applied physics, or other similar fields.

As part of our team, you will:

  • Develop semiconductor and optical packaging processes in-house, or in close partnership with contract manufacturers.
  • Design optical transceiver packages in collaboration with cross-functional teams and stakeholders to ensure package requirements are met.
  • Perform mechanical integrity and thermal simulations, tolerance analyses, and characterization.
  • Plan and Drive prototype assembly builds to enable deliveries for early design validation.
  • Apply in-depth knowledge of advanced packaging principles and stay current with new technological advancements.
  • Drive package debug activities during product validation and qualification.
  • Own Design Rules documents and ensure Design for Manufacturing specifications are met.

You have:

  • Experience with package and process design/development from design to production.
  • Knowledge of design for manufacturing, 2.5D/3D packaging, and TSVs.
  • Experience with documentation of fabrication, inspection, and assembly processes.
  • Solid interpersonal, communication, and problem-solving skills to interact with engineering staff, external vendors, and contractors effectively.

It would be nice if you also had:

  • Understanding of optical epoxies, non-hermetic packaging, and high-volume packaging and thermal analysis of 2.5/ 3D packages
  • Experience in the semiconductor chip and wafer-level back-end processing, assembly, and/or packaging.
  • Experience in high-speed electronics package design and/or laser package design.
  • Experience with thermo-mechanical simulations using ANSYS or similar software.
  • Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging - or equivalent practical work experience.
  • Familiarity with design and simulations of optical packaging using free space optics or fiber coupling.

Come create the technology that helps the world act together
Nokia is committed to innovation and technology leadership across mobile, fixed and cloud networks. Your career here will have a positive impact on people's lives and will help us build the capabilities needed for a more productive, sustainable, and inclusive world.
We challenge ourselves to create an inclusive way of working where we are open to new ideas, empowered to take risks and fearless to bring our authentic selves to work

What we offer
Nokia offers continuous learning opportunities, well-being programs to support you mentally and physically, opportunities to join and get supported by employee resource groups, mentoring programs and highly diverse teams with an inclusive culture where people thrive and are empowered.

Nokia is committed to inclusion and is an equal opportunity employer
Nokia has received the following recognitions for its commitment to inclusion & equality:

  • One of the World's Most Ethical Companies by Ethisphere
  • Gender-Equality Index by Bloomberg
  • Workplace Pride Global Benchmark


At Nokia, we act inclusively and respect the uniqueness of people. Nokia's employment decisions are made regardless of race, color, national or ethnic origin, religion, gender, sexual orientation, gender identity or expression, age, marital status, disability, protected veteran status or other characteristics protected by law.
We are committed to a culture of inclusion built upon our core value of respect.

Join us and be part of a company where you will feel included and empowered to succeed.

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