Current jobs related to Principal Packaging - Leominster - Infineon Technologies

Job description: In your new role you will:Proactively participate in the new product roadmap definitions and cross-examine the development process in order to meet our stretched targets for new product releases, while ensuring manufacture and profitable next generation products in OperationsLead the strategy for long-term process roadmaps and develop new technologies needed for new and next generation productsCollaborate with other R&D functions, Project Management, Operations, and other stakeholders as the focal person to lead the innovation of assembly and mechanical screening processes for New Product Integration(NPI)Develop and update the design rules that will ensure manufacturability, including meeting the required process capability and product reliabilityIdentify and mitigate project risks related to backend processes and materials, through the translation of DFMEA to PFMEA, and using other methods of risk managementResolve development and manufacturing problems with high complexity involving expert networks, through structured problem-solving techniques like 8D and related tools. Exploits deviations as a tool for discoveries that will support continuous improvementDrive technical decisions and develop new process technology, including prototype and production tools and equipment for new productsLead the TRB (technical review board) meetings and collaborationensuring new product designs are aligned to the core and future coreprocess roadmaps.Aside from working with internal manufacturing site, investigate and work with OSATs that will contribute to new product developments. Support supplier quality, purchasing, and other groups to identify andwork with material vendors impacting new products and future of supplychain of the business unitYour Profile: You are best equipped for this task if you have:Bachelor of Science (preferred Master's degree) in engineering, such as mechanical, packaging, chemical, materials, manufacturing, electrical, or electronics engineeringMinimum 10 years in semiconductor or electronic assembly process and/or package engineering; including hands-on experience package and process development for new productsProven ability to define a structured approach in new process research, development, characterization, qualification, and release to productionDeep technical understanding of material, package, and process relationships, as they contribute to product performance and manufacturing / operation efficienciesStrong knowledge in developing and managing on-site and outsourced back end processes, such as die attach, wire bond, package sealing, lead, finish, trim and form, and mechanical assembliesEffective team leader and member, ability to collaborate with otherteams and IR-Hi-Rel/Infineon sites for best practice, resource and knowledge sharing, and lead as expert mentoring technicians and new engineers.Strong multi-tasking and prioritization skills, and effective indefining and meeting ambitious schedules towards project completionSelf-starter, fast-learner with experience working in fast-pace and dynamic manufacturing environmentEmphasizes personal and professional growth, keeps current with technical and business knowledge and skills, maintains a network infield of expertiseDemonstrated strong verbal and written communication skillsAn advantage to have but not required:Proficient in interpretation of mechanical drawings as well as usingCAD softwareKnowledge on military / aerospace industry standards.#LI-TG1Why Us: Infineon designs, develops, manufactures, and markets a broad range of semiconductors and semiconductor-based solutions, focusing on key markets in the automotive, industrial, and consumer sectors. Its products range from standard components to special components for digital, analog, and mixed-signal applications to customer-specific solutions together with the appropriate software.We are on a journey to create the best Infineon for everyone.This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant's experience and skills.We look forward to receiving your resume, even if you do not entirely meet all the requirements of the job posting.Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.Click here for more information about Diversity & Inclusion at Infineon.Driving decarbonization and digitalization. Together.IR HiRel Products Inc., is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex (including pregnancy, childbirth, or related medical conditions), gender identity, national origin, ancestry, citizenship, age, physical or mental disability, legally protected medical condition, family care status, military or veteran status, marital status, domestic partner status, sexual orientation, or any other basis protected by local, state, or federal laws.Employment at Infineon is contingent upon proof of your legal right to work in the United States under applicable law, verification of satisfactory references and successful completion of a background check and drug test, and signing all your on-boarding documents.In some instances, if applicable, U.S. export control laws require that Infineon obtain a U.S. government export license prior to releasing technologies to certain persons. This offer is contingent upon Infineon's ability to satisfy these export control laws as related to your employment and anticipated job activities. The decision whether or not to submit and/or pursue an export license to satisfy this contingency, if applicable, shall be at Infineon's sole discretion.Infineon Technologies takes data privacy and identity theft very seriously. As such, we do not request personally-identifiable information (PII) from applicants over the internet or electronically. Please kindly refrain from disclosing your PII electronically during the application process or to unauthorized websites that may purport to be Infineon or any of our affiliates.This position requires access to documentation that is controlled by the export laws of the United States. Candidates are required to provide proof of either US citizenship, Permanent US residency or classification as a protected individual as defined in 8USC 1324b(a)(3).