Sr. Thermal Engineer

2 weeks ago


Austin, United States Saicon Consultants Full time

Sr. Thermal Engineer

Location:Austin, TX Posted On: 03/26/2024 Requirement Code: 67489 Requirement Detail

Senior Thermal Engineer, DCGAP Thermal MechanicalEngineering THE ROLE: As a Senior Thermal Engineer in the Data Center and GPUAccelerated Processing (DCGAP) Thermal Mechanical Engineering department, youwill be responsible for the thermal design, validation and technologydevelopment for the AMD Data Center GPU products in this expanding andstrategic market for AMD. To accomplishthis, you will need to interact with other key engineering teams such assilicon design, boarding engineering, validation, and manufacturing and leaderswithin AMD, our customers, and our partners. THE PERSON: The Senior Thermal Engineer in the Thermal MechanicalEngineering team will have excellent communication skills, planning skills,technical expertise, is a team player, possesses critical problem solving andtroubleshooting skills, is a self-starter, and is well organized. They will bemarket savvy and comfortable in a fast paced, multi-tasking environment. KEY RESPONSIBILITIES: The Senior Thermal Engineer in the Thermal MechanicalEngineering team will be responsible for the end-to-end development anddelivery of thermal and/or mechanical solutions for the GPU and associatedplatforms. The successful candidate will have a thermal and mechanicaldevelopment background with silicon level or system level experience. They willintegrate into a global development team in delivering commercially viableproducts (silicon to systems) to the marketplace in a timely and cost-effectivemanner. Some of the key responsibilities will include • Designthermal solutions to enable AMD's next generation of Datacenter GPUs • Collaboratewith board engineering, power engineering and other cross-functional teams todesign thermal-mechanical solutions from chip to system level • Contributeto the overall product cycle from conceptualization through mass production • Workin a dynamic and fast-paced product development environment • Thermalvalidation of thermal-mechanical hardware at chip, card and system level • Investigatenovel thermal technologies and work with vendors to productize it • Driveprocess improvements while executing fast time-to-market on products. PREFERRED EXPERIENCE: The selected candidate will use his/her proven technicalskills to ensure the engineering team continuously innovates, uses ‘bestpractices’, and adds value for its customers. Key qualifications requiredinclude • Strongbackground in heat transfer and fluid dynamics with emphasis on electronicsthermal management • CFD/FEA - Experience with Icepak and/or Flotherm is required. FEA experience inANSYS is a plus. • CAD -Experience with SolidWorks and/or Creo is required. • Datacenterand server level design experience • LabSkills - Experience with Design of Experiments, instrumentation, dataacquisition and data analysis, including uncertainty analysis. • Excellentverbal and written communication skills at the engineering and executivelevels, including a proven track record of working across organizationboundaries to define requirements, solve complex problems and drive programs tosuccessful completion • Manufacturing- Good knowledge of Design for Manufacturing, including experience with volumemanufacturing in Asia as well as North America • Experiencewith engineering statistical analysis methods ACADEMIC CREDENTIALS: BS 8+ yrs in Mechanical Engineering or applied physics ispreferred. Any speculation in relatedfield is advantageous. An advancedEngineering degree would be an added plus. Apply Now

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