Development Electronic-acoustical Technical

3 weeks ago

Annapolis, United States Northrop Grumman Full time

**Requisition ID: R10162029**:

- ** Category**: Non-CJCS
- **Location**: Annapolis, Maryland, United States of America
- **Clearance Type**: Secret
- **Telecommute**: No
- Teleworking not available for this position
- **Shift**: 1st Shift (United States of America)
- **Travel Required**: Yes, 10% of the Time
- **Relocation Assistance**: Relocation assistance may be available
- **Positions Available**: 1

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.
Northrop Grumman Mission Systems is seeking a **Development Electronic-Acoustical Technical Specialist** - with hands-on experience and duties of a micro-electronics lab technician to join its Dolphin Works Sonar Innovation Lab in **Annapolis, Maryland.**

**Basic Qualifications**:

- High School Diploma and a minimum of six years related experience, or a technology degree / certificate, or military electronics experience.
- Surface mount soldering certification or extensive demonstrated knowledge and skill in surface mount circuit board assembly, fabrication, and repair.
- Ability to read and interpret electrical schematics and mechanical drawings, as well as provide review and propose suggested improvements to same.
- Extensive knowledge of electronics, circuit theory and hybridized electronic packaging.
- A high degree of skill in fabrication, repair, and test of complex components, assemblies, devices, circuits, and systems.
- Experience performing assembly and test on subsystems and/or subassemblies in a lab environment.
- Experience providing technical assistance to engineering personnel for product and process development.
- U.S. Citizen with ability to obtain and maintain a Secret Security Clearance.

**Preferred Skills and Qualifications**:

- Experience fabricating sonar transducers and custom digital and analog circuits.
- Participate in the safe execution of tasks required in support of research and development and production for commercial, military, and classified programs as the demand requires.
- Implement design and process engineering for the manufacture of complex, hybridized packaging, including development of processes for injection molding and encapsulation, hybrid packaging assembly, PCB surface mount technology, and materials testing.
- Knowledge of production equipment, and raw materials used (chemicals, metals, polymers, composites, etc.), process monitoring and control, process development and documentation, routine equipment maintenance requirements, and industry standards and trends.
- Familiar with Lab equipment setup and operation of, but not limited to: X-Ray machine, wire bonder, BGA re-work apparatus, measuring microscope, batch ovens, hyperbaric chamber, etc.
- Provide research for procurement and installation of process and analysis equipment - requiring special consideration and understanding of the materials, processes, the operating environment, and the raw materials used.
- Able to ensure delivered products meet company quality standards, consist of the latest technology, and are manufactured according to detailed/ specific process instructions. This requires knowledge of major process technologies, expected results of these processes, risk management, failure analysis/rework procedures and capabilities, time analysis of processes for scheduling purposes and reporting of project status to customer.
- Oversee junior engineers and technicians involved in packaging of hybrid electronics, providing mentoring, guidance, and training as needed in a fast-paced development environment.
- Interface with other departments as SME to resolve problems.
- Take part in corrective actions and process changes as well as cost improvement initiatives.

**Competencies for Success**:

- Adapt readily to changing assignments and requirements in a team first, fast paced, mission focused environment - multitasking and prioritizing with flexibility.
- Positive individual who is willing to expand current skill set through schooling and training.
- Strong interpersonal communication skills with ability to work with others at all levels and across a high performing organization.
- Strong attention to detail and accuracy

**Salary Range**:$51,140 - $124,440

Employees may be eligible for a discretionary bonus in addi

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