Jr. / Sr. Packaging Engineer

Elevate Quantum (EQ) is America’s Quantum Tech Hub—designatedby the U.S. Department of Commerce andrepresentingthe largest concentration of quantum organizations in the world. EQoperatesat the center of a rapidly scaling ecosystem spanning industry, academia, national laboratories, and government across Colorado, New Mexico, and Wyoming. Our mission is to accelerate the commercialization of quantum technology and translate regional scientific leadership into lasting economic impact.

EQ is not a traditional nonprofit—it is an execution engine responsible for deploying capital, standing up infrastructure, and delivering measurable outcomes across a diverse portfolio of programs. The organizationoperatesacross five core business units:

Advanced Packaging Facility

Focused on high-mix, low- to medium-volume production, this facility supports quantum and advanced photonics companies with capabilitiesin optoelectronics packagingsuch as flip chip bonding, solder attach,wire-bonding, fiber-to-chip coupling, andvariousmetrologycapabilities. In partnership with Sandia National Laboratories, EQ is helping bridge the gap between research and scalable manufacturing.

Photonic Integrated Circuit (PIC) Fabrication Facility

A rapid-turn, low-volume fabrication facility designed for quantum-relevant materials (including silicon nitride and lithium niobate), enabling significantly faster iteration cycles than traditional foundries and supporting early-stage and scaling companies alike.

Commercialization Labs

A shared-use environment offering access to advanced equipment, lab space, and the nation’s first open-access, open-architecture quantum system. These labs provide critical infrastructure for testing, prototyping, andvalidatingemerging technologies.

Workforce Development

Spanning Colorado and New Mexico, EQ’s workforce programs combine ecosystem coordination with hands‑on training delivered on real equipment. These programs are designed to build the next generation of quantum technicians and support a rapidly growing talent pipeline.

Consortium Engagement

EQ manages a 150+ member coalition andconvenesthe broader ecosystem through advisory boards, CEO roundtables, major events, and cross-state collaboration. The organization also partners with state and regional entities to attract companies, align strategy, and drive continued investment into the region.

Together, these business units form a vertically integrated platform—one that spans infrastructure, talent, commercialization, and ecosystem activation. EQ’s role is to ensure these componentsoperatecohesively to accelerate the path from scientificbreakthroughsto commercial deployment at scale.

JOB SUMMARY

Reporting to the Director of Packaging, the Jr. / Sr. Packaging Engineer will drive the development ofoptoelectronicpackaging andintegration processes, qualifying them and supporting the launch of new processes. As part of the development team, the Jr. / Sr. Packaging Engineer will helpidentifyand develop innovative solutions to process and manufacturing challenges in a team-based and fast-paced environment.

ESSENTIALJOBFUNCTIONS

Planningand executingexperiments forthedevelopment of newelectronicand photonicpackaging processes (joining such as flip chipand wire bonding,reflow processes, optical couplingsuch as fiber to shipattach etc.).

Employingvariousmetrology tools andtechniques,and reliability tests to understand and improve the performance of theprocesses.

Optimizingassemblyprocesses,FMEAand root cause analysis.

Compilingand analyzingdata,writingreports, and presentingresults to team members and management.

Supportingthe launchof new processesand trainingmanufacturing personnel.

Maintaining and improving the established processes andequipment,andproviding support to production and troubleshooting technical issues.

Interfacingwithvendors of equipment andprocess materials.

JOB QUALIFICATIONS & REQUIREMENTS

Requiredqualifications:

M.S. or Ph.D. inPhysics,Materials Science, Mechanical Engineering,Chemistryor relatedfield.

Minimum3-7years of experiencewithphotonic systems and integration,electronic packaging,solder systems and reflow processes in a high- techindustry (Quantum,MEMS, semiconductor, or PCB).

Strong foundationof materials scienceand opticsprinciples and hands-on experience withfiber alignment procedures, flip chip bonders, wire bonders, andreflow ovens.

Hands-on experience in setting up and maintaining optoelectronic packaging processes, equipment and metrology methods for the control and monitoring of such processes.

Experience withdiagnosing issues using failure analysis techniques and equipment, researching, and recommending solutions.

Experiencewithprofilometry,surface and bulk analytical methods r