Quantum Superconducting Materials Engineer

GlobalFoundries Fab8 is seeking an experienced R&D cryogenic / superconducting materials engineer to become part of our Quantum Advanced Packaging team.

The primary responsibility of this position is to own development, selection, and integration of cryogenic and superconducting materials enabling high-performance, scalable quantum packaging technologies from concept through manufacturing.

About GlobalFoundries GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.

Job Summary

GlobalFoundries Fab8 is seeking an experienced R&D cryogenic / superconducting materials engineer to become part of our Quantum Advanced Packaging team. The primary responsibility of this position is to own development, selection, and integration of cryogenic and superconducting materials enabling high-performance, scalable quantum packaging technologies from concept through manufacturing.

Essential Responsibilities

• Lead selection and development of materials systems for cryogenic and superconducting packaging, including:
  • Superconducting metals (Nb, Al, NbN, etc.)
  • Interconnect materials (In, Cu, Sn-based systems)
  • Dielectric, substrate, and bonding interface materials
• Establish material schemes compatible with millikelvin–cryogenic operating environments
• Evaluate material suitability for:
  • Electrical conductivity / superconductivity
  • Thermal conductivity / isolation
  • Mechanical robustness under cryogenic cycling
• Drive integration of materials into 2D, 2.5D, and 3D advanced packaging architectures.
• Define material stacks and interfaces across:
  • BEOL / RDL layers
  • Interposers and TSVs
  • Bump and bonding interfaces
• Ensure compatibility of materials with process flows, tools, and downstream assembly operations.
• Own materials-related process integration from early development through prototyping and qualification.
• Drive process development, optimization, and control plans for deposition, plating, bonding, and surface preparation.
• Enable smooth movement of prototypes and development lots across fab and assembly workflows.
• Develop deep understanding of temperature-dependent material properties including:
  • Superconducting transitions
  • Electrical resistivity and RF loss
  • Thermal transport behavior
  • Mechanical stress/CTE mismatch
• Define and utilize characterization methods (electrical, thermal, structural) to evaluate materials performance.
• Correlate material behavior with device- and system-level performance impacts.
• Identify and analyze failure mechanisms, including:
  • Delamination and interface failure
  • Diffusion / intermetallic formation
  • Stress‑induced cracking during thermal cycling
• Develop material solutions and process mitigations to enhance reliability.
• Drive long‑term reliability strategies for cryogenic operation.
• Develop materials solutions that:
  • Improve yield and process robustness
  • Reduce cycle time and cost
• Partner with integration teams to ensure scalable and manufacturable material choices.
• Work directly with material suppliers and equipment vendors to:
  • Evaluate new materials (e.g., superconducting films, hybrid materials)
  • Define material specifications and qualifications
  • Collaborate with OSATs and partners to enable wafer‑level and die‑level integration flows.
• Interface across:
  • Interconnect / bump / TSV / assembly integration teams
  • Device / qubit / system engineering teams
• Enable co‑optimization of materials + process + system architecture.
• Drive development of next‑generation materials for scalable quantum systems, including:
  • Superconducting interconnect stacks
  • Cryogenic‑compatible dielectrics and bonding materials
• Contribute to APPC quantum packaging roadmap and capability build‑out.
• Track and evaluate emerging materials and integration schemes.
• Generate:
  • Material specifications and process guidelines
  • Integration documentation and characterization reports
• Communicate results to internal and external stakeholders.
• Support IP generation, publications, and conference outputs.
• Define materials strategy across multiple quantum pla