Principal Hardware Architect

3 weeks ago


Mountain View CA, United States General Motors Full time

General Motors is redefining mobility with electrification, autonomous driving, and software-defined vehicle platforms. Our Hardware Architecture team is at the forefront of this transformation, developing the next generation of zonal and centralized compute architectures. We are seeking a Principal Hardware Architect with deep expertise in vehicle E/E systems, semiconductor technology, and high speed hardware design to lead the definition and optimization of our future hardware platforms. Making sure you fit the guidelines as an applicant for this role is essential, please read the below carefully. This role is categorized as hybrid. The successful candidate is expected to report to Mountain View, CA or Warren, MI three times (Tues., Wed., Thurs.) per week, at minimum [or other frequency dictated by the business]. The Role As a Principal Hardware Architect, you will define and drive the hardware architecture for GM’s next-generation zonal and centralized vehicle platforms. You will evaluate tradeoffs across compute, networking, harnessing, and ECU design to deliver scalable, reliable, and cost-effective solutions. This role requires a strong systems-level perspective, deep technical expertise, and the ability to collaborate across hardware, software, and vehicle architecture teams. The Principal Hardware Architect will play a pivotal role in shaping the future of GM’s vehicle electrical and electronic (E/E) architecture. As the industry transitions toward zonal architectures, centralized compute, and software-defined vehicles, this role ensures that hardware platforms are designed with the right tradeoffs in performance, cost, scalability, and reliability. By bridging semiconductor technology, physical layer networks, and ECU hardware requirements, the Principal Hardware Architect will define the foundation for next generation vehicle platforms. Responsibilities Architectural Leadership Define and evolve GM’s zonal hardware architecture, balancing performance, cost, scalability, and reliability. Lead tradeoff analysis across compute partitioning, networking, harnessing, and ECU design. Translate semiconductor technology roadmaps into platform-level hardware requirements. System & Network Integration Define physical layer network topology and constraints for in-vehicle communication (Ethernet, CAN, LIN, PCIe, etc.). Decompose system-level requirements into ECU- and harness-level specifications. Collaborate with software architects to align hardware and software partitioning on microprocessors. Hardware Design Requirements Define ECU hardware design requirements, including power, thermal, and signal integrity considerations. Provide guidance on high-speed PCB design and layout best practices. Ensure manufacturability, reliability, and compliance with automotive standards. Cross-Functional Collaboration Partner with vehicle architecture, system architecture, software, and semiconductor teams to ensure cohesive system design. Serve as a technical authority and mentor for hardware engineering teams. Influence supplier and technology partner roadmaps to align with GM’s long-term strategy. Innovation & Continuous Improvement Drive adoption of new technologies, tools, and methodologies in hardware architecture. Anticipate future vehicle architecture needs and propose forward-looking solutions. Qualifications Education & Experience Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or related field. 12+ years of experience in hardware/system architecture, with significant experience in automotive or other high-reliability industries. Proven track record of defining and delivering complex hardware architectures at scale. Technical Expertise Deep understanding of zonal architectures and vehicle E/E tradeoffs. Strong knowledge of software partitioning on microprocessors and its hardware implications. Expertise in physical layer network topology (Ethernet, CAN, LIN, PCIe, SerDes) and constraints. Ability to map semiconductor technology capabilities to physical layer and harness requirements. Strong background in high-speed PCB design and layout. Thorough understanding of vehicle architectures and tradeoff analysis. Leadership & Collaboration Ability to influence cross-functional teams and drive alignment across hardware, software, and vehicle architecture. Strong communication skills for engaging with technical and executive stakeholders. Experience mentoring and guiding engineering teams. Compensation The compensation information is a good faith estimate only. It is based on what a successful applicant might be paid in accordance with applicable state laws. The compensation may not be representative for positions located outside of New York, Colorado, California, or Washington. The expected base compensation for this role is: $228,900 - $350,500. Actual base compensation within the identified range will vary based on factors relevant to the position. Bonus Potential: An incentive pay program offers payouts based on company performance, job level, and individual performance. Company Vehicle: Upon successful completion of a motor vehicle report review, you will be eligible to participate in a company vehicle evaluation program, through which you will be assigned a General Motors vehicle to drive and evaluate. Note: program participants are required to purchase/lease a qualifying GM vehicle every four years unless one of a limited number of exceptions applies. Benefits: GM offers a variety of health and wellbeing benefit programs. Benefit options include medical, dental, vision, Health Savings Account, Flexible Spending Accounts, retirement savings plan, sickness and accident benefits, life insurance, paid vacation & holidays, tuition assistance programs, employee assistance program, GM vehicle discounts and more. #J-18808-Ljbffr



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