Principal R&D Thermal Product Development Engineer

Principal R&D Thermal Product Development EngineerAt TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world.Job OverviewTE Connectivity’s R&D/Product Development Engineering Teams are responsible for driving new products from concept to high-volume manufacturing. From market definition through production and release, the teamconduct feasibility studiesperform/direct/support detailed design, prototyping, testing, and manufacturing ramp of new and modified designsdefine material requirements and new or improved manufacturing processesassist in the qualification of suppliers for new productThe Thermal Development Group within the Advanced Development Team has responsibility for finding innovative solutions to thermal challenges in the high-speed interconnect industry, including thermal design and evaluation of associated products. Through modeling and physical validation, those solutions are enabled by the larger TE manufacturing base to be brought to the global market.Job RequirementsDevelop innovative cooling solutions for the high-speed digital interconnect industry.Research and apply emerging technologies to new product development.Analyze electronics cooling problems through robust modeling methods.Address near-adjacent technical challenges such as:ManufacturabilityTolerancingStructural IntegrityLife CycleCost & Market AcceptanceHelp expand global Best Known Methods related to simulation.Present data and ideas in a clear and impactful manner.Interface with engineering teams of various disciplines, including external customers.What your background should look likeBachelor’s Degree in related field required; Masters or PhD preferred.10+ years of engineering experience, including 6+ years in the electronics cooling industry.10+ years of thermal modeling with ANSYS Icepak, Fluent, and/or similar CFD tool.3D CAD skills with PTC Creo (ProE) or ANSYS SpaceClaimExperience with and knowledge of liquid and/or immersion cooling.Experience with mechanical structural analysis is a plus.Self-motivated, efficient, able to work with little or no supervision, and committed to a team approach.Strong interpersonal, organization, and project management skills.Ability to prioritize responsibilities in a fast-paced work environment.Experience in and knowledge of the high-speed digital industry is a plus.Experience in core processes such as stamping, molding, plating, and assembly preferred.Familiarity with standards related to data center cooling (e.g, ASHRAE).Track record of innovation (patents, publications, etc.).Key Attributes Needed:Ability to understand and discuss technical engineering issues.Ability to read and understand engineering drawings and specifications.Comfortable interfacing with and presenting to various disciplines.Attention to detail and accuracy.Ability to work on multiple concurrent projects.SET: Strategy, Execution, Talent (for managers).About TE ConnectivityTE Connectivity is a global industrial technology leader creating a safer, sustainable, productive, and connected future. Our broad range of connectivity and sensor solutions enable the distribution of power, signal and data to advance next-generation transportation, renewable energy, automated factories, data centers, medical technology and more. With more than 85,000 employees, including 8,000 engineers, in approximately 140 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at te.com/careers and on LinkedIn, Facebook, WeChat, Instagram and X (formerly Twitter).Compensation & BenefitsCOMPENSATION• Competitive base salary commensurate with experience: $154,100 – 192,600 (subject to change dependent on location).• Total Compensation = Base Salary + Incentive(s) + BenefitsBENEFITS• A comprehensive benefits package including health insurance, 401(k), disability, life insurance, employee stock purchase plan, paid time off and voluntary benefits.EOE, Including Disability/VetsImportant Notice Regarding Recruitment FraudTE Connectivity has become aware of fraudulent recruitment activities. TE Connectivity never requests payment or fees from job applicants at any stage of the recruitment process. All legitimate job openings are posted on our official careers website at te.com/careers, and emails from our recruitment team will come only from addresses ending in @te.com. If you receive suspicious communications, do not engage and report the incident to local authorities.Location: Middletown, PA, US, 17057City: MiddletownState: PACountry/Region: USTravel: 10% to 25%Requisition ID: 139307 #J-18808-Ljbffr