ASIC Package Design Engineer

3 weeks ago

Milpitas, United States Socionext US Full time

Socionext Inc. (SNI) Overview Socionext Inc. (SNI) is an innovative enterprise that designs, develops and delivers System-on-Chip solutions to customers worldwide. The company is focused on AR/VR, ADAS, imaging, networking, data storage and other dynamic technologies that drive today’s leading-edge applications. Socionext combines world‑class expertise, experience, and an extensive IP portfolio to provide exceptional solutions and ensure a better quality of experience for customers. Founded in 2015, Socionext Inc. is headquartered in Yokohama, and has offices in Japan, Asia, United States and Europe to lead its product development and sales activities. Socionext America Inc. (SNA), a wholly owned subsidiary of SNI. Senior Engineer, Package Design (Milpitas, CA) We are seeking a Senior Engineer, Package Design to work from our Milpitas, CA office. Base Pay Range $180,000.00/yr - $215,000.00/yr Direct message the job poster from Socionext US Responsibilities The Package Engineering function provides support, expertise, and insight to the Silicon device development team through preliminary activities of package selection, routing techniques and necessary simulation work. The position involves diverse responsibilities, including evaluation of new packaging technology, package recommendation for custom devices, substrate design support, device/package qualification. You will be reporting to the Director of Package design (USA) and also you will be working very closely with Package/Manufacturing team in our headquarter (Japan), Marketing and Engineering teams located in our Santa Clara office during pre/post sales process. Qualifications Education Bachelor’s degree in Electrical Engineering, or other semiconductor packaging related discipline Required Experience and Skills 8 to 10 years of experience in semiconductor packaging design and simulations Record of success in cross-functional team environment Good experience with SI/PI tools for package level extraction/simulation Ability to work with Package Layout engineers Strong presentation and communication skills Preferred Experience and Skills Good knowledge of IC package materials and manufacturing Benefits Medical insurance Vision insurance 401(k) Disability insurance Tuition assistance Location Milpitas, CA #J-18808-Ljbffr

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