Postdoctoral Associate

The Department of Mechanical Engineering at the University of Maryland, College Park, announces multiple open postdoctoral positions focused on the development of novel materials and systems for thermal management of power and microelectronic systems, energy storage, cryogenic systems, wideband gap materials, and Machine Learning based electrothermal analysis of devices. The Postdoctoral Associate will perform research under the direction of PIs - Dr. Samuel Graham and Dr. Damena Agonafer.

The project objectives include the development of a novel thermal management system for high power electronic devices employing evaporative cooling technology, evaporative membrane design for low surface tension dielectric coolant and the development of a revolutionary composite metal/organic phase change material for transient thermal management, novel ALD/CVD/PVD surface coating and structures for immersion boiling enhancement. In addition, we will be deploying physics informed neural network modeling to predict the electrothermal behavior or high power rf devices.

Anticipated responsibilities include the assembly and/or modification of specialized test equipment and facilities, the development and application of novel measurement techniques, the performance of detailed measurements and analyses, and interactions with collaborators. Also, duties will include the development of a PINN modeling framework for electrical and thermal response under various bias conditions. Familiarity with neural network modeling and GaN rf-devices will be important.

Candidates are expected to be self-motivated, with the ability to work independently and as an integral member of a team. The postdoctoral appointment would entail performing research, mentoring of students, and helping with project management and fundraising activities, including presentations to sponsors and preparation of proposals. Strong oral and written communication skills, as evidenced by refereed journal publications and conference presentations, are essential.

Project Descriptions:

1. Thermal management of high powered electronics using thin-film evaporation and immersion boiling.

a. Design and development of an evaporating cooling module for cooling of high-powered micro- and power electronics. A test rig and environmental chamber will be designed for benchtop testing to be integrated with sensors and DAQ. Two-phase evaporation simulations using VOF and UDFs in ANSYS-Fluent are also required.

b. Fundamental studies of boiling heat transfer that includes fabrication of novel boiling enhancement surfaces to enhance critical heat flux and heat transfer coefficient and development of an immersion cooling test rig.

2. Development of novel metal/organic hybrid phase change material (PCM) for energy storage and electronics transient thermal loading.

a. Study of a novel phase change materials which includes synthesis of the materials, conducting different thermophysical property measurements using DSC, thermal conductivity measurement apparatus etc, developing an experimental test rig to study the thermal performance of the phase change material. Thermal simulations to study the transient thermal performance of the materials is required.

3. Neural network ML modeling to predict the RF device performance and failure mechanisms.

a. This project involves physics informed neural network modeling of the electrothermal response of GaN RF devices. A combination of experimental data and hybrid data/modeling approaches will be used to tain the neural network for performance prediction of RF GaN HEMT devices. PINN modeling required use of the NVIDIA SimNet toolkit to solve for electrical and thermal transport.