Principal Microelectronics Engineer

1 month ago

Costa Mesa, United States Sanmina Corporation Full time

Job Purpose:

Candidate will lead the design and development of innovative microelectronics packaging solutions for high density memory products targeted at the defense, aerospace, and commercial markets.

Nature of Duties/Responsibilities:

  • Lead a team of engineers and subcontractors in the development and qualification of DRAM and Flash products including multichip modules (MCM), plastic ball grid array multichip packages (MCP), and System-In-Package (SiP) solutions.
  • Responsible for project scheduling and execution, project status reporting, and providing technical guidance to the team.
  • Interface directly with onshore and offshore assembly and test subcontractors (OSAT) and OEM customers.
  • Some travel may be required.

Education and Experience:

  • Minimum 10-12 years related experience.
  • BS in Microelectronics Packaging, EE, Mechanical Engineering, Physics, or Materials.
  • Experience in the design of semiconductor packages such as plastic ball grid arrays, MultiChip Packages (MCPs), and System-in-Package (SiP).
  • Solid understanding of semiconductor package design parameters and their influence on cost, thermal and electrical performance, reliability, and manufacturability.
  • Experience leading cross-functional engineering teams in complex microelectronics packaging projects.
  • Project management experience including scheduling, status reporting, and subcontractor management.
  • Thorough understanding of microelectronics package design flow, including mechanical design, signal integrity simulation, thermal simulation, schematic capture, and PCB layout.
  • Thorough understanding of high volume manufacturing processes for semiconductor ICs (backend packaging and test).
  • Familiarity with silicon wafer post-process techniques such as wafer thinning, dicing, and RDL application.
  • Thorough understanding and experience in packaging qualification testing techniques and industry standard test methods.
  • Experience interfacing directly with onshore and offshore microelectronics assembly and test subcontractors (OSAT).
  • Experience with printed circuit board assembly, SMT processing equipment and methods.
  • Familiarity with integrated circuit functional test and burn in techniques.
  • Excellent verbal and written communication skills.

PACKAGING Skills:

  • Wafer level packaging, Wafer preparation (dicing, grinding, wafer expansion, die singulation).
  • Die pick and place, Die Attach, Die Stack, MEMS die, FLIP CHIP, Underfill, Thermo-compression bonding, WIREBOND, Molding (transfer mold).
  • Compression mold, vacuum mold, film-assist mold, Dam and Fill dispense, Ball Attach, Solder Reflow, Singulation, Tape and Reel, SMT (Surface Mount Technology). Packages handled and developed: QFP, TQFP, SOP, TSOP, QFN, Flip Chip, Cu pillar FC, BGA, CSP, FAN-OUT WAFER LEVEL PACKAGING (FOWLP), 2.5DIC, 3DIC, Thru mold vias, Thru-silicon.

Sanmina is an Equal Opportunity Employer - M/F/Veteran/Disability/Sexual Orientation/Gender Identity.

This is an ITAR facility. Must be US Citizen or lawful permanent resident.

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