Principal IC Package Design Engineer

About Ethernovia, Inc.

Ethernovia is developing the future of Ethernet-based networks to realize the full potential of software-defined and autonomous vehicles, robotics and other intelligent machines. Founded in 2018, the company's breakthrough data transport and acceleration technology is ushering in a new era of connectivity and capabilities in the vehicle and at the edge, including highly reliable autonomy, over-the-air servicing and AI-backed applications.

About Ethernovia, Inc.

Ethernovia is developing the future of Ethernet-based networks to realize the full potential of software-defined and autonomous vehicles, robotics and other intelligent machines. Founded in 2018, the company's breakthrough data transport and acceleration technology is ushering in a new era of connectivity and capabilities in the vehicle and at the edge, including highly reliable autonomy, over-the-air servicing and AI-backed applications.

Ethernovia's co-founders are serial technology entrepreneurs with multiple prior successful ventures together. We are well-funded and backed by some of the worlds' leading technology investors, having secured $154M ($90+M Series-B and $64M Series-A) in total funding to date:

• Ethernovia Raises Over $90 Million Series B to Scale Leading-Edge Autonomy and Physical AI Networking Chips
• Ethernovia Raises $64 Million to Accelerate the Revolution of Vehicle Networks | Business Wire
• • (financial backers include: Porsche SE, Qualcomm, AMD, Western Digital, Maverick Silicon, Socratic Partners, Conduit Capital, and CDIB-TEN Capital)

Ethernovia has been recognized in EE Times' prestigious list of the Top 100 Startups for 2025.

• March 2026: Ethernovia Announces HSB-Enabled Networking Board for NVIDIA Holoscan Platforms
• January 2024: Our CEO Ramin Shirani Named MotorTrend Software-Defined Vehicle Innovator Awards Winner (ethernovia.com)
• September 2023: Continental and Ethernovia Announce Partnership to Develop Automotive Switch in 7nm - Ethernovia
• Connected Car News: Helios, Continental, Ethernovia, Avanci, BMW, Mapbox, Porsche, SEMA, Honda, UltraSense, Flex Logix, Diodes Inc., Garmin, Toyota & Caruso | auto connected car news

With talented employees on 4 continents, we have filed 50+ patents to date.

Join Ethernovia's team to make a lasting impact on the future of packet processor-centric networking solutions to support the real-time sensor, Physical AI, and control data demands of software-defined autonomy across vehicles, robots and intelligent machines.

Come share in our success with pre-IPO shares, competitive compensation, and great benefits while growing your knowledge and career with world-class talent. We are looking for talented engineers and leaders who have an entrepreneurial spirit and want to drive cutting-edge designs from concept to silicon to the future of mobility.

Principal IC Package Design Engineer

Summary:

We are seeking a visionary and deeply technical Principal IC Package Design Engineer to lead the architecture, design, and execution of advanced packaging solutions for our next-generation Ethernet switches and PHYs. You will be responsible for the entire package lifecycle—from early-stage feasibility and architectural definition to detailed layout, signal/power integrity (SI/PI) co-design, thermal management, and mass production release.

Key Responsibilities

• Package Architecture & Feasibility: Lead the definition of package concepts, substrate stack-ups, bump/ball maps, and pinouts to optimize for system cost, electrical performance, and thermal constraints.
• Detailed Package Design: Execute complex, high-speed, multi-layer package layouts (FCBGA, FCCSP, SiP) utilizing industry-standard EDA tools.
• SI/PI & Thermal Co-Design: Partner closely with Signal/Power Integrity and Thermal engineers to ensure package designs meet stringent targets for high-speed SerDes (56G/112G+), power delivery networks (PDN), and thermal dissipation.
• Substrate Design Integration: Define design rules and manage substrate layout, routing optimization, and manufacturing constraints (DFM/DFA).
• OSAT & Vendor Management: Drive technical engagements with leading substrate suppliers and OSATs. Evaluate vendor capabilities, negotiate design rules, and resolve manufacturing/assembly issues during NPI (New Product Introduction) and production ramp.
• Cross-Functional Collaboration: Act as the bridge between Silicon IC Design and System/PCB teams to ensure seamless chip-package-board co-design and optimization.
• Technology Roadmap: Stay at the forefront of semiconductor packaging trends (e.g., advanced organic substrates, glass substrates, co-packaged optics) to influence Ethernovia's long-term hardware ro