Technician: Engineering Laboratory

3 weeks ago


Chandler, United States Superbeo Full time
Job DescriptionJob DescriptionDescription:
*Please note: This is an on-site role 100% of the time. Laptop will be issued for this role.

Do not submit same candidates submitted prior to JP25863.

The candidate will be responsible for conducting failure analysis needed identify electrical & thermal mechanical package failures and supporting root cause understanding of new package technologies being developed.

Skill sets required not limited to the following:

Demonstrated skills in X-section/planar polishing, Optical microscopy imaging, and SEM/EDX on printed circuit board are preferred. Knowledge of packaging material property and behavior is beneficial.

Candidate must also demonstrate good verbal and technical writing skills, work well with a team, deliver under pressure, and well organized.

Minimum educational qualification is an AS degree in science or engineering and 2-4 years experience in failure analysis, material analysis, process development or analytical tool development.
Must be able to stand and work for at least 6 hours.

Additional Details

  • Manager's Requested Bill Rate : 39.30
  • Does the position allow for the worker to be virtual/remote? : No
  • Shore Options Available for this Position : Onshore Only
  • Critical Position? : No
  • PO Number (Intel Federal and Construction Only) : Enter PO here if applicable
  • Shift Hours : 8am-5pm
  • Shift Days : Monday-Friday
  • Intel Specific Job Title : (No Value)
  • Project ID : Enter Project ID


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