3rd Optical Inspector Level 4

2 months ago


Milpitas, United States Integra Technologies. Full time
Job DescriptionJob Description

Job Title: 3rd Optical Inspector Level 4 FLSA Status: Non-Exempt

Reports To: Production Manager

Department Name: 165 – Mfg – Inspection – 3rd Optical

Location: Silicon Valley

POSITION SUMMARY (Briefly describe the purpose of the position)

Check automatic or manual die bonding machines that bonds integrated circuit dies to package cavity (pad) orientation. Perform multi tasks in clean room assembly area including but not limited to 3rd optical visual inspection.

KEY RESPONSIBILITIES/ESSENTIAL FUNCTIONS INCLUDE (List in order of importance)

Level 4:

  • Perform visual inspection of 100x or higher in magnifications for verification of defects of die devices.
  • Understand many different rules and exceptions on different die devices for visual inspection.
  • Understand all criteria both hermetic and non-hermetic for inspection.
  • Perform visual inspection in device specifications to the GaAs visual document. Be able to identify different die devices by the string near the edge.
  • Use X-ray machine to handle die orientation for accuracy.
  • Responsible to operate machine using Camtek tool for wafer inspection.
  • Review defects found per customer specs. Understanding the editing and reclassification of wafers.
  • Meet or exceed 95%+ yield requirement or better at QC sample inspection.
  • Identify and report process deviations to supervisor.
  • Meet quality goals, safety requirements, and follow company policies.
  • Flexibility to perform other duties as assigned.

JOB REQUIREMENTS INCLUDE (List as required or preferred)

Education: High school diploma or equivalent required.

Experience: 6 months in quality inspection or microelectronic production environment preferred. Experience in 2nd optical and/or 3rd optical inspections certified Glass S. Cond A, Glass B, cond. B, and Commercial preferred.

Knowledge/Skills:

  • Familiar with procedure of wafer and die.
  • Familiar with devices wafer, wafer maps, die location, multi-die ID, small and thin die, big die, bump die.
  • Experience with hand tools such as tweezers, vacuum, pickup tools, die handling.

SUPERVISORY RESPONSIBILITIES

Total Number of Employees Directly Supervising: _0_

Number of Subordinate Supervisors Reporting to Position: _0_



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