Laser Module Packaging Engineer

3 weeks ago

Mountain View, United States Lightmatter Full time
Job DescriptionJob Description

Laser Module Packaging Engineer

Lightmatter is redefining what computers and human beings are capable of by delivering a fundamentally new kind of computer that calculates using light. Transistors, the workhorse of modern computers, aren't improving at the rate they once were. To scale AI, companies are building increasingly large and energy-expensive data centers—a path that is neither financially nor environmentally sustainable. By delivering ultra-high performance and energy efficiency, Lightmatter’s compute engine will power rapid advancements in AI while lowering its environmental footprint.

Lightmatter is looking for a technical lead to drive Laser Module development and manufacturing required across multiple product lines for the company. You will be part of a cross-functional team consisting of silicon photonics, packaging, test, reliability, quality , system engineers and supply chain to scale up various Laser Module designs from prototype to high-volume production. You will be responsible for performing design optimization across optical, mechanical, thermal and electrical domains and working closely with vendors to develop robust assembly and test processes to deliver high yielding & reliable laser package modules that meet product requirements. This position offers a unique opportunity to bring innovative concepts in laser technology to market. It provides significant opportunities to innovate by solving complex interactions across silicon photonics, packaging technologies, and system architectures.

Responsibilities
    • Collaborate with cross-functional teams, including hardware designers, PCB layout engineers, and system architects to ensure seamless integration of the Laser Module and support throughout the product development lifecycle.
    • Collaborate with silicon photonics, package, and systems teams to understand the overall laser module performance targets.
    • Actively manage suppliers, manufacturing partners and internal subject matter experts to ensure timely project execution.
    • Develop and optimize assembly and test processes to meet yield requirements, ensuring high-quality production standards.
    • Plan and execute Design of Experiments (DOE) with active and mechanical samples to validate quality specifications and improve reliability.
    • Collect and analyze reliability data, driving corrective actions to maintain product performance and quality.
    • Coordinate the delivery of engineering samples for product purchase orders.
    • Document and communicate results, design guidelines, and recommendations to internal stakeholders, management, and customers.
    • Perform or oversee necessary mechanical and/or thermal design studies to assist in Laser Module development from concept phase through high-volume manufacturing.
    • Perform or oversee necessary optical simulations to define requirements for various components in the laser module.

Requirements

    • B.S. with 8 years of experience, M.S. with 6 years of experience, or Ph.D. with 3 years of experience in Electrical or Mechanical Engineering, Physics, Material Science, or a relevant field.
    • At least 5 years of experience in Semiconductor Laser packaging design and assembly, volume manufacturing, process integration, and qualification.
    • Knowledge of CWDM/DWDM lasers and systems, TEC, Mux, isolator, SOA, and single-mode fiber coupling.
    • Understanding of component requirements and functionality within a laser module and the ability to design and optimize to meet the product performance/reliability targets.
    • Knowledge of Mechanical design processes and software experience using CAD tools such as Solidworks.
    • Understanding of electrical requirements such as driver circuit on board requirements and layouts.
    • Understanding of packaging thermals and mechanical consideration such as heat transfer, mechanical strain, and stress.
    • Ability to establish key interactions between photonic devices and package technology; suggest methods to resolve issues and drive solutions.

Preferred Qualifications

    • Hands-on experience with die bonding, flip chip, ,), lens alignment , fiber attach, and wire bonding processes.
    • Expertise in optical photonics numerical design and proficiency with simulation tools such as Zemax.
    • Exposure to quality and reliability requirements for optical components.
    • Excellent verbal and written communication skills to effectively collaborate with cross-functional teams and present findings to stakeholders.

Benefits

  • Comprehensive Health Care Plan (Medical, Dental & Vision)
  • 401k matching
  • Life Insurance (Basic, Voluntary & AD&D)
  • Generous Time Off (Vacation, Sick & Public Holidays)
  • Paid Family Leave
  • Short Term & Long Term Disability
  • Training & Development
  • Flexible, hybrid workplace model
  • Stock Option Plan

We offer competitive compensation. The base salary range for this role, including all US locations, is $125,000 to $205,000. Your base salary will be determined based on location, experience, educational background, and market data.

Lightmatter recruits, employs, trains, compensates, and promotes regardless of race, religion, color, national origin, sex, disability, age, veteran status, and other protected status as required by applicable law.

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