Microcircuits Assembler

Active secret clearance preferred, willing to consider candidates with a previously held active clearance.
Interim secret clearance is required to start the position.

Job Description:

• Performs fabrication or modification tasks on RF Microwave hybrid microcircuits and sub-assemblies.
• Duties include performing gold wire bonding using manual and automated 0.001" and 0.0007" machines and ribbon bonding to duroid and ceramic substrates, capacitors, resistors, diodes, spirals and other microelectronic components.
• This position requires wirebonding onto small pad sizes down to 0.001" in assemblies with very high semiconductor chip density and unusual substrate configurations which require special setup and bonding techniques.
• This position will require the capability to troubleshoot defective hybrids circuit card assemblies by visually screening wirebonds or chip placement.
• Duties will also include installation of substrates and components in highly complex microwave assemblies using paste and sheet epoxies.
• It also requires the utilization of measurement equipment (e.g. reticle, drop indicator, bond puller) to check parameters during and after work completion to assure that the unit conforms to specifications.
• Plans work sequence by assessing work in progress to schedule requirements.
• The position will also require collaboration with Manufacturing and Quality Engineering on procedures and troubleshooting methodologies.

Basic Required Qualifications:

• Experience in wire bonding and ribbon bonding (0.001" and 0.0007" wire and various sizes of ribbon)
• Ability to work 10 hours under a microscope and utilize hand tools such as torque drivers, tweezers and other similar tools
• Good dexterity and eye/hand coordination
• Experience in microelectronics assembly (chip and wire assembly)
• Ability to read and work from detailed work instructions and drawings; computer skills are required to support retrieval of drawings and work instructions as well as other job activities
• Ability to work in a diverse team environment; Good interpersonal, teaming and communication skills
• High School Diploma required

Desired Skills:

• Experience in hybrid assembly in accordance with Mil STD 883
• Experience wirebonding or ribbon bonding to ceramic or duroid substrates
• Experience using Westbond and Metcal bonding machines and Unitech welder.
• Experience in substrate and component attach, auto pick-and-place
• Experience operating auto or manual bonding equipment
• Familiarity working in an ESD and FOD controlled environment
• Experience in mechanical assembly processes of small electronic devices
• Experience working on military products in ISO 9001 / AS9100 controlled environments