Packaging Engineer, Sensors

2 weeks ago


Hawthorne CA United States SpaceX Full time

SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars.

PACKAGING ENGINEER, SENSORS (AVIONICS)

SpaceX is looking for a Packaging Engineer to support the transition of new sensors from the development stage to full production. Within this role, you will be responsible for developing fabrication and manufacturing processes and qualifying those processes for high-volume production. You will additionally be responsible for selecting or designing custom manufacturing equipment. This is a unique technical role to transition cutting-edge sensors to high-volume production.

RESPONSIBILITIES:

  • Develop MEMS/semiconductor packaging processes and qualify those processes for high-volume production
  • Identifying key equipment/technologies and building custom systems for packaging miniature sensors
  • Collaboratively identify and resolve manufacturing issues
  • Establish process monitors, pass/fail metrics, and implement process controls
  • Complete yield analysis and support process changes to improve yield
  • Support of full product characterization and reliability testing efforts

BASIC QUALIFICATIONS:

  • Bachelor's degree in electrical engineering, mechanical engineering, materials, or other engineering field
  • 1+ years of experience in the MEMS/Semiconductor industry

PREFERRED SKILLS AND EXPERIENCE:

  • Master's degree in electrical engineering, mechanical engineering, materials
  • 2+ years of experience in the MEMS or Semiconductor industry
  • Experience transitioning MEMS or semiconductor devices from development to production
  • MEMS or semiconductor packaging experience, including one or more of the following: dicing, die-attach, pick-and-place, flip-chip, wire bonding, wafer bonding, encapsulation, or vacuum sealing
  • Knowledge of advanced chip packaging and integration of multiple components in a single package
  • Experience with hermetic or vacuum-sealed devices
  • Experience developing automated production systems

ADDITIONAL REQUIREMENTS:

  • Must be willing to support extended hours and weekends when necessary to support launch and critical project timelines
  • Must be willing to travel


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