Mechanical Engineer with Security Clearance

Found in: Dice One Red US C2 - 1 week ago


Lexington, United States John Galt Staffing Full time
The Quantum Information and Integrated Nanosystems Group seeks an individual interested in packaging of compound semiconductor devices for use in integrated photonic systems. The candidate will have a hands-on role in the areas of material processing and component assembly. The candidate’s responsibilities will include design of assemblies, including thermal and stress analysis where needed, as well as procurement and assembly of parts. The individual will collaborate with a multi-disciplinary team to develop a wide variety of packaging solutions for testing, and/or delivery, of discrete devices or photonic systems including lasers, photodetectors, optical modulators, and passive optical interconnects. Required Qualifications:
•Experience with hands on (preferably 5 years) assembly of photonic systems that include compound semiconductor such as laser, modulators and photodetectors
•Experience working with compound semiconductor device processing
•Ability to work independently with minimal supervision and collaboratively as part of a dynamic, multi-disciplinary team
•Excellent organization and communication skills
•Bachelor’s degree in mechanical engineering, materials science, physics, or a related field Preferred Qualifications:
•Master’s degree in mechanical engineering, materials science, physics, or a related field
•Experience with or knowledge of one or more of the following areas:
Microfabrication techniques (e.g., photolithography, evaporation, sputtering) and process integration
Optoelectronic or RF device testing (e.g. I-V, edge coupling, S-parameters, etc.)
Capital equipment maintenance Clearance:
Candidates should have an active clearance (secret/top secret, etc.) in order to be considered for this position due to the nature of the work being done.
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