IC Packaging Engineer

4 weeks ago


San Jose, United States Power Integrations Full time

Description

Job Description

  • Responsible for defining substrate/package design rules, process flow and material set for new automotive power module packages
  • Drive alignment between module substrate (PCB) design requirements and supplier capabilities, to enable new product development and volume manufacturing of power modules
  • Develop new assembly technologies, run process DOE’s, to define process windows for new package development
  • Drive reliability testing and qualification of new automotive module packages in conjunction with the reliability group
  • Work closely with offshore assembly and substrate partners to develop new processes
  • Work closely with IC design teams to define package design rules and define packages to meet their requirements
  • Collaborate with multi-functional teams within Power Integrations for successful development, qualification and production ramp of new module products

Job Requirements

  • BS Degree in Electrical Engineering, Mechanical Engineering, Material Science.
  • Minimum experience 8 years in semiconductor packaging technology.
  • Experience leaded multi-die packages.
  • Understanding of organic laminate technologies manufacturing and supplier capabilities.
  • Experience in SMT or passive integrated package assembly is a plus.
  • Experience with packaging processes: Wafer Back-grinding, Wafer Dicing, Die Attach, Wire-bonding, Molding, and Package Singulation. (Flip Chip is a plus)
  • Experience with package substrate design rules, tools (including AutoCAD).
  • Knowledge of AEQ Automotive reliability requirements.
  • Knowledge of APQP automotive development process
  • Knowledge of JEDEC/IPC design standards.
  • Ability to set-up Design Rule Checks for verification of every aspect of the PCB layout a plus.
  • Travel to Asia to attend technology reviews and resolve subcon/supplier issues


Pay: to $150K commensurate with experience



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