Principal Microelectronic Packaging Mechanical Design Engineer or a Senior Principal Microelectronic Packaging Mechanical Design Engineer.

2 weeks ago


Baltimore, United States Northrop Grumman Full time

Northrop Grumman Mission Systems is seeking a Principal Microelectronic Packaging Mechanical Design Engineer/ Senior Principal Microelectronic Packaging Mechanical Design Engineer to join our team of qualified, diverse individuals. This position will be located in Baltimore, Maryland.


Overview:

You will work as part of a cross-functional team that is responsible for the design and development of cutting-edge AESA antenna hardware that is featured in Northrop Grumman's world-class radar, ESM, and communications systems, that are fielded on a multitude of airborne, marine, ground-based, and space military platforms. You'll support multiple projects spanning the product lifecycle, from R&D to full-rate production. Some example AESA products can be viewed at this website:


As an integral part of the Engineering and Sciences team, you will be responsible for the design and development of cutting-edge AESA antenna hardware that is featured in Northrop Grumman's world-class radar, ESM, and communications systems.


This position may be filled as a Principal Microelectronic Packaging Mechanical Design Engineer or a Senior Principal Microelectronic Packaging Mechanical Design Engineer.

Roles and Responsibilities include:

  • Design, prototyping, and production support of state-of-the-art RF, digital, and mixed-signal multi-chip modules (MCMs), Printed Wiring Boards (PWBs), and Circuit Card Assemblies (CCAs) using various substrate materials and chip-scale packaging technologies
  • Collaboration within a cross-functional Integrated Product Team (IPT); effective and timely communication with peers in adjacent functions, including electrical design, systems engineering, thermal analysis, structural analysis, drafting, supply chain management, and manufacturing.
  • Organizing and prioritizing tasks to accomplish project milestones within schedule and budgetary constraints.
  • Providing technical leadership and mentoring to less experienced personnel.


Basic Qualifications for Principal Microelectronic Packaging Mechanical Design Engineer:

  • Bachelor’s degree with 5 years of experience, a Master’s degree with 3 years of experience or a PhD with 0 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields.
  • U.S Citizenship with the ability to obtain/maintain an active DoD Secret Clearance
  • Experience with microelectronic packaging design, including chip-scale packaging technologies and substrate\PWB layout
  • Working knowledge of materials, specifications, manufacturing processes, and design tools utilized for multi-chip modules, PWBs, and CCAs
  • Proficient with AutoCAD
  • Familiarity with NX or other 3D modeling software


Basic Qualifications for Senior Principal Microelectronic Packaging Mechanical Design Engineer:

  • Bachelor’s degree with 9 years of experience, a Master’s degree with 7 years of experience or a PhD with 4 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields.
  • U.S Citizenship with the ability to obtain/maintain an active DoD Secret Clearance
  • Experience with microelectronic packaging design, including chip-scale packaging technologies and substrate\PWB layout
  • Working knowledge of materials, specifications, manufacturing processes and design tools utilized for multi-chip modules, PWBs and CCAs
  • Proficient with AutoCAD
  • Familiarity with NX or other 3D modeling software


Preferred Qualifications:

  • Advanced degrees in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields.
  • Active DoD Secret Clearance or higher
  • Proficiency with ASME Y14.5 geometric dimensioning and tolerancing (GD&T) and ASME Y14.100 engineering drawing practices
  • Familiarity with thermal and structural analysis considerations, methodologies, and software tools
  • Experience with hands-on assembly and testing of prototype electronic hardware
  • Experience in a technical leadership role on a cross-functional product development team


This position is contingent on the ability to obtain or maintain a US Secret Clearance or higher.



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