RF-mmWave Packaging Engineer

4 weeks ago

Sunnyvale, United States L&T Technology Services Full time

Responsibilities:

  • Design, simulate and validate advanced RF/mmWave packaging/module solutions. Liaise with OSAT vendors for manufacturing.
  • Design, simulate and validate Integrated passive device (IPD). Liaise with foundry for Tapeout.
  • Design PCB schematic, layout and perform circuit and 3D EM simulation.
  • RF lab debug, tuning, performance optimization and validation.


Minimum Qualification:

  • 3+ years of experience in developing RF/mmWave packages and IPD design.
  • At least BSEE or BSc in related engineering discipline
  • In depth knowledge in electromagnetics, RF filters, PA and LNA design.
  • Experience with foundry Tapeout and working with OSAT vendors.
  • Experience in RF schematics, layouts, and DFM.
  • Experience with RF lab equipment and probe station for device characterization, debug, and component/system performance validation.
  • Experience using circuit, EM, and thermal simulation tools such as Ansys HFSS, Keysight ADS/Momentum, Cadence Allegro, Cadence Virtuoso, Ansys Icepak, Flotherm.
  • Good communicator and team player.


Preferred Qualification:

  • MS or PhD in EE with emphasis on advanced packaging or RFIC/mmWave design
  • 5+ years of relevant industry experience
  • Familiar with RF system design.
  • Familiar with regulatory requirements (FCC, CE, etc.).

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