Glass Core Technology

2 months ago

New Albany, United States Samtec Inc Full time

Founded in 1976, Samtec is a privately held, $950 million global manufacturer of a broad line of electronic interconnect solutions, including High-Speed Board-to-Board, High-Speed Cables, Mid-Board and Panel Optics, Precision RF, Flexible Stacking, and Micro/Rugged components and cables. Samtec Technology Centers are dedicated to developing and advancing technologies, strategies and products to optimize both the performance and cost of a system from the bare die to an interface 100 meters away, and all interconnect points in between. With 40+ international locations and products sold in more than 125 different countries, Samtec’s global presence enables its unmatched customer service.

Samtec began investing in Microelectronics in 2010 and has emerged as a technology leader in advanced glass-based packaging. As we expand our investment in this cutting-edge technology, we are looking for energetic and innovative experts to join our growing team of scientists and engineers developing glass interposers and other novel device fabrication technologies for transparent substrates. One critical role is for a world-class wafer development engineering director to join the Glass Core Technology Development Center and Wafer Fab in New Albany, Indiana. The successful candidate will be responsible for developing wafer fabrication process, integration flows, and metrology tools for enabling novel devices to be fabricated. They will work with the engineering, manufacturing, sales and marketing teams to ensure that products being developed for our GCT customers (both internal and external to Samtec) meet performance, design, and price requirements, and they can be further fabricated and integrated into the customers’ final products.

**THIS POSITION WILL BE ONSITE IN NEW ALBANY, IN **

Summary/Objective: This position will be responsible for developing wafter fabrication process, integration flows, and metrology tools for enabling novel devices to be fabricated. This position will work with the engineering, manufacturing, sales, and marketing teams to ensure that products being developed for our GCT customers (both internal and external to Samtec) meet performance, design, and price requirements, and they can be further fabricated and integrated into the customers’ final products.

Essential Functions/ Responsibilities:

  1. Engineering leadership over GCT technology development and implementation, including:
  2. Through glass via (TGV) fabrication and filling technologies
  3. Wafer-based fabrication processes to allow electrical, optical, and fluidic interconnects.
  4. Process integration flows that enable novel device fabrication
  5. Metrology and test methodologies for characterizing wafers and devices
  6. Work with Sales and Marketing and Samtec customers to understand the devices and fabrication/integration processes that should be developed as part of the GCT technology roadmap.
  7. Collaborate with operations to understand process and production issues and bottleneck, to ensure future development efforts provide continuous improvement solutions.
  8. Work closely with other Samtec development/product groups that are incorporating GCT components in their products to ensure the GCT devices work in their applications and understand enabling technologies required to be developed to align with their product and technology roadmaps.
  9. Create and execute technical project mgmt. plans with Samtec’s Project Management Office. This includes people/team direction, and schedule management.
  10. Work jointly with Application Engineering to resolve product technical issues during and after customer design in.
  11. Grow and develop the GCT engineering team.

“The responsibilities as defined are intended to serve as a general guideline for this position. Associates may be asked to perform additional tasks depending on strengths and capabilities”

Preferred Experience:

  1. 10+ years of experience in wafer engineering, and wafer fabrication and engineering.
  2. Minimum of 5+ years of Engineering Management experience.
  3. Expertise with Glass, Silicon, Semiconductor, or Hard drive wafer process development and integration, qualification and high-volume manufacturing strongly desired..
  4. Experience with fab equipment including lithography (i-line), PVD, CVD, wet etch, dry etch (RIE), ECD Cu plating, electrical test, and characterization is strongly desired.
  5. Demonstrated success at developing process flows which integrate process modules (litho, deposition, etch) to deliver new products for customers on time.
  6. Experience managing and growing an engineering group.
  7. Ability to work across functional groups and “lead from the side”
  8. Ability to communicate clearly and effectively with operators and senior management.
  9. Ability to meet International Traffic in Arms Regulations (ITAR) compliance requirements.
  10. Strong technical and verbal/written communication skills

Preferred Education:

  1. Master’s Degree or greater in Materials Science, Chemical Engineering, Chemistry, Physics, or related field.

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