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Mechanical Design Engineer

3 months ago

Fort Lee, United States Xscape Photonics Inc Full time

Job Overview: Xscape photonics is looking for a talented mechanical design engineer in photonics and

electronics packaging. Your role is to design and develop co-packaging solutions for photonic and

electronic components. You will ensure that these components are integrated into larger systems while

maintaining their functionality, protection, and thermal management.


Key Responsibilities:


1. Package Design: Design and optimize packaging solutions for photonic and electronic

components, considering factors such as thermal management, mechanical stability, electrical

connectivity, and optical alignment.

2. Thermal Management: Develop thermal solutions to manage heat generated by electronic

components and photonic devices, including heat sinks, thermal vias, and cooling mechanisms.

3. Material Selection: Choose appropriate materials for packaging components, considering

factors like thermal conductivity, thermal expansion, electrical insulation, and environmental

resistance.

4. Environmental Sealing: Design hermetic or environmentally sealed packages to protect

components from dust, moisture, and other contaminants.

5. Mechanical Integration: Design mechanical interfaces for the integration of components into

larger systems, ensuring precise alignment, structural stability, and compatibility with other

mechanical components using CAD software such as SolidWorks and AutoCAD.

6. Thermal and Stress Analysis: Perform advanced thermal analysis using software tools (e.g.,

ANSYS, COMSOL, or SolidWorks Simulation) to model and simulate heat transfer, conduction,

convection, and radiation in mechanical systems.

7. Prototyping and Testing: Build and test prototypes to validate thermal and mechanical

performance, and analyze experimental data. Make design improvements based on test results.

8. Quality Control: Implement quality control measures to ensure that packaging solutions meet

specified performance standards and reliability requirements.

9. Documentation and Reporting: Maintain comprehensive documentation of design

specifications, simulation results, test data, and performance metrics. Prepare technical reports

and presentations.

10. Cross-Functional Collaboration: Collaborate with cross-functional teams, including electrical

engineers, optical/photonics engineers, and process engineers, to develop comprehensive

solutions for photonic and electronic packaging.

11. Regulatory Compliance: Ensure that packaging solutions adhere to industry standards and

relevant regulatory requirements, especially in applications such as telecommunications,

medical devices, and data communication.

12. Innovation and Research: Stay updated with the latest advancements in photonics, electronics,

and packaging technology. Contribute to research and development efforts to advance the field

and develop new packaging solutions.

13. Project Management: Manage engineering projects related to photonic and electronic

packaging, including setting timelines, budgets, and milestones, to ensure successful project


completion.

Qualifications:

  • Bachelor's, Master's, or Ph.D. in Physics, Mechanical Engineering or a related field.
  • Proficiency in CAD software for package design and mechanical system integration.
  • Strong understanding of thermal management principles, material properties, and electrical and

optical integration.

  • Knowledge of semiconductor fabrication processes, cleanroom techniques, and photonic device

technology.

  • Strong problem-solving skills and attention to detail.
  • Excellent communication and teamwork skills.
  • Adaptability to emerging technologies and industry trends in photonic and electronic packaging.


Compensation: Competitive cash and stock compensation, dependent on education and experience. Fully paid medical, dental, and vision insurance.