Principal / Sr. Principal RF Design Engineer - Mixed Signal Packaging EMC Analysis & Design - Security Clearance Required

Found in: Talent US A C2 - 2 weeks ago

Annapolis, United States Northrop Grumman Full time
Northrop Grumman Mission Systems (NGMS) Advanced Capabilities division is leading the development of the next generation of high-performance computing. Superconducting electronics forms the core of our technology, with a focus on energy-efficient computation using our patented superconducting digital logic technology, Reciprocal Quantum Logic (RQL). On a gate-for-gate basis, RQL consumes orders of magnitude less power than CMOS while running at significantly higher clock speeds.

The Advanced Capabilities division seeks experienced RF Microwave Design Engineers to develop these technologies into high-performance computing systems. You'll work in a fast-paced team environment alongside physicists, design engineers, and superconducting foundry engineers to make these technologies a reality.

How you will contribute to the Mission:
  • Lead and/or contribute directly, working on design and analysis of signal integrity and electromagnetic effects in highly complex high frequency, high dynamic range mixed signal systems in a very collaborative and innovative research and development environment
  • Perform analytical studies of electronic systems (integrated circuits, chip-level packaging, interposers, printed circuit boards, connectors, etc.) to support design tradeoffs
  • Design and analysis activities include electromagnetic modeling (e.g. SSN, ISI, crosstalk, EMC/EMI) for packaging parasitic estimation, associated interconnect, PCBA and filters. All design, testing and verification efforts ensure simulated and measured results meet desired design targets, and continually improve simulation-measurement correlation
  • Develop new test and simulation methods as necessary to support the above activities when demands exceed the state of the art
  • Create new design strategies where possible to support functional requirements while meeting SI, PI and EM goals
  • Deep understanding of RF/EMC measurement and analysis (s-parameters, eigenmodes, TDR, FFT, IF, etc.)
  • Work closely with other domain experts performing related functional analyses (e.g. Mechanical design & analysis, circuit design & test, thermal analysis, etc.)
  • Willingness to continually expand the knowledge base of yourself and the team (e.g. examine new research, relevant papers, seek applicable methodologies in adjacent applications, etc.)
  • Coordinate related technical team activities
  • Present details of work to colleagues during design reviews
  • Create and manage work plans to meet or exceed schedule deadlines
  • Provide written and oral summaries of work performed as needed (e.g. for reports)
This position will serve on-site in Linthicum, MD or Annapolis Junction, MD.

This position will be filled at the Principal or Sr. Principal RF Microwave Design Engineer level based on the qualifications below:

Basic Qualifications for the Principal RF Microwave Design Engineer - Mixed Signal Packaging, EMC Analysis & Design:
  • Bachelors degree in a STEM related field with 5 or more years' of relevant experience required. Masters degree and 3 years of relevant experience
  • Working knowledge of CAD/simulation tools (e.g. HFSS, CST Studio, Sonnet, ADS, HSPICE, SI-Wave, Sigrity) in support of design and analysis
  • Experience with high frequency measurement techniques in frequency and time domains for characterizing various interconnect features such as insertion loss, return loss, impedance, and crosstalk.
  • Understanding of electromagnetic theory, transmission line theory, network analysis, and high-speed measurement, calibration, and de-embedding techniques.
  • Knowledge of fundamental electrical engineering and circuit design principles.
  • Use of Microsoft Office tools (Word, Excel, PowerPoint) and proficiency in writing for reporting.
  • Ability to obtain and maintain a U.S. TS/SCI with Poly Security Clearance for which U.S. Citizenship is a requirement
Basic Qualifications for the Sr. Principal RF Microwave Design Engineer - Mixed Signal Packaging, EMC Analysis & Design:
  • Bachelors degree in a STEM related field with 9 or more years' of relevant experience required. Masters degree and 7 years of relevant experience
  • Working knowledge of CAD/simulation tools (e.g. HFSS, CST Studio, Sonnet, ADS, HSPICE, SI-Wave, Sigrity) in support of design and analysis
  • Experience with high frequency measurement techniques in frequency and time domains for characterizing various interconnect features such as insertion loss, return loss, impedance, and crosstalk.
  • Understanding of electromagnetic theory, transmission line theory, network analysis, and high-speed measurement, calibration, and de-embedding techniques.
  • Knowledge of fundamental electrical engineering and circuit design principles.
  • Use of Microsoft Office tools (Word, Excel, PowerPoint) and proficiency in writing for reporting.
  • Ability to obtain and maintain a U.S. TS/SCI with Poly Security Clearance for which U.S. Citizenship is a requirement
Preferred Qualifications:
  • Ansys HFSS modeling for RF packaging effects
  • Experience with spectrum and network analyzer techniques for EMC measurements
  • Familiarity with packaging technology (e.g. ceramic and laminate chip-level packages, printed circuit boards, interposers, wire bonding, etc.)
  • Familiarity with cryogenic test stands, superconductivity, mechanical CTE
  • Active U.S. TS/SCI with Poly Security Clearance for which U.S. Citizenship is a requirement

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