Lead Photonics Packaging Engineer

1 week ago


Palo Alto, California, United States PsiQuantum Full time
Job Summary:
The Senior Optical Packaging Engineer will be responsible for developing high-performance and robust fiber-to-chip packages and scalable packaging processes for optical systems comprised of optical fibers attached to various chip-based photonic integrated circuits.

Responsibilities:
- Develop an optical package and fiber-to-chip alignment scheme allowing for high alignment accuracy and scalable assembly,
- Help develop packaging prototypes and scalable fiber-to-chip packaging flows, NPI,
- Review packaging design BOMs, work with the supply chain on procuring parts needed for assembly,
- Establish and update version-controlled DFM requirements and feed back to the packaging design group,
- Work with the manufacturing group and vendors on transferring and scaling packaging designs and processes based on successful prototypes,
- Advise the manufacturing group and vendors on setting up high-throughput packaging assembly lines,
- Collaborate with external vendors and suppliers to source required materials and provide feedback on evolving requirements.

Requirements:
- Mandatory qualifications: Bachelor's degree or above in Engineering, Physics, or Material Science, 10+ years of experience with/at a semiconductor company or supplier working on PIC packaging design, qualification & multi-chip assemblies, 5+ years of experience working with optical fibers, optical measurements, 5+ years of work experience with advanced semiconductor packaging OSAT (Outsourced Semiconductor Assembly & Test) and/or EOL vendors, 5+ years of experience with a semiconductor company or supplier working on FAU / optical connector to chip attachment, Experience with fiber attach tooling & process/flow development and optical data analysis.

About Us:
PsiQuantum is a pioneering company aiming to build the world's first useful quantum computer. Our architecture is based on photonics, enabling us to produce components using existing high-volume semiconductor manufacturing processes. We are committed to delivering exceptional talent to join our team in achieving this extraordinary goal.

Compensation:
The expected base pay range for a fully qualified candidate is $150,000 - $200,000 USD. Full-time roles are eligible for equity and benefits.

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