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Principal Mixed-Signal Electronic Design Engineer

4 months ago


Reston, United States Draper Labs Full time


Principal Mixed-Signal Electronic Design Engineer

Job Location

US-MA-Cambridge | US-VA-Reston

Requisition ID

2021-5603

Overview

Draper is an independent, nonprofit research and development company headquartered in Cambridge, MA. The 2,000+ employees of Draper tackle important national challenges with a promise of delivering successful and usable solutions. From military defense and space exploration to biomedical engineering, lives often depend on the solutions we provide. Our multidisciplinary teams of engineers and scientists work in a collaborative environment that inspires the cross-fertilization of ideas necessary for true innovation. For more information about Draper, visit www.draper.com.

Our work is very important to us, but so is our life outside of work. Draper supports many programs to improve work-life balance including workplace flexibility, employee clubs ranging from photography to yoga, health and finance workshops, off site social events and discounts to local museums and cultural activities. If this specific job opportunity and the chance to work at a nationally renowned R&D innovation company appeals to you, apply now www.draper.com/careers.

Equal Employment Opportunity

Draper is committed to creating a diverse environment and is proud to be an affirmative action and equal opportunity employer. We understand the value of diversity and its impact on a high-performance culture. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, disability, age, sexual orientation, gender identity, national origin, veteran status, or genetic information.

Draper is committed to providing access, equal opportunity and reasonable accommodation for individuals with disabilities in employment, its services, programs, and activities. To request reasonable accommodation, please contact hr@draper.com.

Responsibilities

We are seeking a Principal Mixed Signal Electrical Engineer to join the Low Power Electronics group. As a principal member of the technical staff, the candidate will play a critical role in the development of next generation sensor/actuator hardware within the Electronics Division. Members of the Embedded Electronics group support a variety of multi-disciplinary programs lasting an average of 12 to 18 months each. In addition to working on sponsored programs, group members are also encouraged to develop and participate in internally funded research and development programs.

The ideal candidate is someone who works well in cross-functional teams and has extensive experience interfacing with sensors/actuators and wireless systems with low size, weight, and power requirements.

Core Responsibilities:

  • System architecture design and trade studies
  • Proposal development and project execution
  • Detailed electrical analysis and design for mixed-signal electronics
  • Schematic capture, simulation, and PCB layout/oversight
  • Prototype bring up and debugging
  • Functional verification
  • Performance characterization


Qualifications

Required Qualifications:

  • MS in Electrical Engineering (PhD preferred)
  • 15+ years of work experience in mixed-signal electronic design
  • Outstanding technical capability with strong electrical engineering fundamentals
  • Experience leading teams of engineers as well as a background in developing new products/business
  • Excellent written and oral communication

Additional Desired Qualifications:

  • Experience in all of the following areas of electronic design: miniature low power embedded systems, sensor integration, wireless communication interfaces, battery conditioning and maintenance.

  • Basic experience with microcontroller software (using C/C++/or assembly), and FPGA firmware (VHDL or Verilog). Ability to develop code for bring-up tests or simple demos.

  • Familiarity with signal and power integrity analysis tools (Hyperlinx, Ansys)

  • Experience with miniature electronic packaging and design using bare die or chip-scale packages. Ability to understand and influence packaging design constraints and requirements for custom designs.

Security Requirement:

Applicants selected for this position will be required to obtain and maintain a U.S. Security Clearance. A primary requirement for a security clearance is US citizenship.

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