Wafer Wet Process Development Engineer

2 days ago

Fremont CA United States Western Digital Full time

Company Description

At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible.

At our core, Western Digital is a company of problem solvers. People achieve extraordinary things given the right technology. For decades, we’ve been doing just that. Our technology helped people put a man on the moon.

We are a key partner to some of the largest and highest growth organizations in the world. From energizing the most competitive gaming platforms, to enabling systems to make cities safer and cars smarter and more connected, to powering the data centers behind many of the world’s biggest companies and public cloud, Western Digital is fueling a brighter, smarter future.

Binge-watch any shows, use social media or shop online lately? You’ll find Western Digital supporting the storage infrastructure behind many of these platforms. And, that flash memory card that captures and preserves your most precious moments? That’s us, too.

We offer an expansive portfolio of technologies, storage devices and platforms for business and consumers alike. Our data-centric solutions are comprised of the Western Digital, G-Technology, SanDisk and WD brands.

Today’s exceptional challenges require your unique skills. It’s You & Western Digital. Together, we’re the next BIG thing in data.

Job Description

As a Wafer Wet Process Development Engineer, you will be responsible for developing new wet processes and technologies such as electroplating, wet etch, lift-off, cleaning, and CMP. Your role will involve enabling and accelerating HAMR device wet process development and related technology deployment into head products to meet HDD requirements throughout the product lifecycle.

Key Responsibilities:

  • Develop new electroplating materials and processes for HAMR device fabrication.
  • Perform wafer plating, wet etch, lift-off, and wafer cleaning process development to meet new product launch requirements and schedules.
  • Define related wet process roadmaps, and develop or evaluate new processing technologies, methodologies, consumables, or advanced tooling to meet new product needs and manufacturability.
  • Collaborate with cross-functional teams, including design, integration, and other development process modules, to incorporate associated wet processes or resolve integration issues.
  • Troubleshoot issues in the development line, conduct defect analyses, root cause analyses, and implement corrective and preventive actions.
  • Transfer new processes to the manufacturing engineering (ME) team and support them in process implementation and manufacturing ramp-up.
Qualifications

Required:

  • BS + 7 yrs experience, MS +3 yrs experience or PhD +1 yrs experience in physics, chemistry, chemical engineering, materials science, or a related engineering field.
  • Experience in related wafer chemical process development.
  • Understanding of other process techniques, such as photolithography, dry etching, or thin film deposition processes.
  • Experience in wafer-level device fabrication and integration.
  • Excellent communication skills, both written and oral, with the ability to resolve issues and interact with various interdepartmental teams and support organizations.
  • Demonstrated leadership and project management skills, capable of managing teams and projects with set milestones and timelines, and the ability to execute.

Preferred:

  • Experience with noble metal and alloy electroplating development.

This position is essential in driving innovation and ensuring the successful deployment of cutting-edge technologies in our products. If you are passionate about process development and eager to contribute to a dynamic team, we invite you to apply.

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