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Focal Plane Array Packaging Engineer
3 months ago
Provide technical leadership in backend processing, including flip-chip hybridization, lap and polish, AR coating, wire-bonding and epoxy die attach/bonding. Develop and improve processes focusing on process yield, capability, and throughput. Apply knowledge of packaging, semiconductor processing, and device physics to enhance FPA development and innovation. Uphold stringent cleanroom manufacturing standards, emphasizing safety, quality, and workflow efficiency. Collaborate effectively with cross-functional teams, demonstrating project management skills to drive FPA packaging development projects from concept to completion. Maintain rigorous documentation and adhere to industry protocols, ensuring consistent quality and compliance. Lead and mentor team members, promoting a results-driven culture of continuous improvement.
Skills:
packaging engineering, packaging design, semiconductor manufacturing, mechanical, packaging
Top Skills Details:
packaging engineering,packaging design,semiconductor manufacturing,mechanical,packaging
Additional Skills & Qualifications:
BS or MS in Physics, Material Science, Electrical Engineering, Mechanical Engineering, Industrial Engineering or related fields with a minimum of 3-5+ years Expertise in semiconductor packaging, including wire bonding and epoxy die attach/bonding. Experience with specialty equipment qualification and calibration; ability to troubleshoot specialty equipment and custom tooling (in coordination with Equipment Engineering). Strong excel and data analysis skills; familiarity with data analysis software packages such as JMP is preferred. Knowledge of statistical process control (SPC) and six-sigma practices. Experience working hands-on in a cleanroom manufacturing environment. Proven ability to work in a team-oriented, fast-paced environment, managing multiple priorities and projects with efficiency and reliability. Strong analytical skills, detail-oriented, with a commitment to quality and safety Proficiency with Microsoft 365 applications, including Excel, Word, and Outlook. Preferred Skills Background in IR FPA Packaging, particularly flip-chip hybridization techniques Setting up electronic test equipment and performing device screening Knowledge of semiconductor device physics, photodetectors, and FPAs Background in semiconductor processing Programming experience, Python in particular
Experience Level:
Intermediate Level
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